Superwave Laser Technology Co.,Ltd
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Laser scriber

Superwave Laser Technology Co.,Ltd | Updated: Jun 11, 2018

Application field

Wafer cutting and grooving of monocrystalline silicon, polycrystalline silicon cell and silicon wafer in the solar energy industry; Film cutting and marking of amorphous silicon film panels; In the electronics industry silicon, germanium, gallium arsenide and other semiconductor substrate materials and cutting.

Product features

Beam quality of high quality (base mode TEM00), small focus, smooth surface, smooth section;
Direct cutting, no need to break pieces;
Higher conversion efficiency, no consumable replacement of vulnerable parts, low cost of use;
The laser has a long service life and is truly maintenance-free. The whole machine is highly reliable, stable and safe.
Digital control, compact size, modular design, convenient service, reduce operators necessary training level;
The performance of pv on the chip section of the CLC cell is better than that of the lamp pump marking, and the yield of the modified silicon chip is more than 99%.

Technical parameters

Laser wavelength: 1064nm;
Average output power: 20W;
The accuracy of the slice is less than or equal to plus or minus 10.
Maximum marking speed: 120mm/s;
The width of the draw line is less than 20 degrees Celsius m;
The working table has a width of 300 * 300mm.