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A brief analysis of the main application of laser scribing machine

Superwave Laser Technology Co.,Ltd | Updated: Jun 11, 2018

Laser slicing technology is a key technology in the production of integrated circuits. The marking is thin and the precision is high (line width is 15-25. In IC production, thousands of circuits are made on a single substrate and separated into a single core before packaging. The traditional method is to use diamond grinding wheel cutting, the surface of the silicon wafer due to mechanical force produced radiation cracks. By using laser marking technology, the laser beam is focused on the surface of the silicon wafer, resulting in high temperature to vaporize the material and form a groove.

The depth of the groove can be precisely controlled by adjusting the pulse overlap amount, which makes it easy for the silicon chip to break neatly along the groove. Since the laser is focused into a very small spot and the thermal influence area is very small, the temperature rise of the active device will not affect the performance of the active device when the trench is cut 50 centimetres deep. Laser cutting is non-contact processing, silicon chip will not be subject to mechanical force and crack. Therefore, it can improve the utilization rate of silicon wafer, high yield and good cutting quality. It can also be used for chip cutting of monocrystalline silicon, polycrystalline silicon, amorphous silicon solar cells, silicon, germanium, arsenide and other semiconductor substrate materials.